Method of forming fine patterns of semiconductor device

ABSTRACT

A method of forming fine patterns of a semiconductor device, in which a plurality of conductive lines formed in a cell array region are integrally formed with contact pads for connecting the conductive lines to a peripheral circuit. In this method, a plurality of mold mask patterns, each including a first portion extending in a first direction and a second portion which is integrally formed with the first portion and extends in a second direction, are formed within a cell block on a substrate comprising a film which is to be etched. A first mask layer covering sidewalls and an upper surface of each of the plurality of mold mask patterns is formed on the substrate. First mask patterns are formed by partially removing the first mask layer so that a first area of the first mask layer remains and a second area of the first mask layer is removed. The first area of the first mask layer covers sidewalls of adjacent mold mask patterns from among the plurality of mold mask patterns by being located between the adjacent mold mask patterns, and the second area of the first mask layer covers portions of the sidewalls of the plurality of mold mask patterns, the portions corresponding to an outermost sidewall of a mold mask pattern block.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of Korean Patent Application No.10-2008-0035819, filed on Apr. 17, 2008, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND OF THE INVENTION

The present invention relates generally to semiconductor devices and,more particularly, to semiconductor device manufacturing.

In a cell array region of a semiconductor device, a plurality ofconductive lines for defining unit cells, for example, a plurality ofword lines and a plurality of bit lines, are arranged in a predetermineddirection.

FIG. 1 is a block diagram of a memory cell array 100 of a conventionalNAND flash memory device, which is a type of non-volatile memory device,and an X-decoder 110 and a Y-decoder 120, which are peripheral circuitsof the memory cell array 100. FIG. 2 is a circuit diagram of a structureof the memory cell array 100.

Referring to FIGS. 1 and 2, the conventional NAND flash memory deviceincludes the memory cell array 100 which includes a plurality of memorycell blocks 100A each made up of a plurality of memory cells. TheX-decoder 110 selects word lines WL₀, WL₁, through to WL_(m−1), andWL_(m) of the memory cell blocks 100A, and the Y-decoder 120 selects bitlines BL₀, BL₁, through to BL_(n−1), and BL_(n) of the memory cellblocks 100A. A Y-gating 130 is connected to the Y-decoder 120 anddesignates paths of the bit lines of the memory cell array 100.

Each of the memory cell blocks 100A of the memory cell array 100includes a plurality of cell strings 10 formed between the bit linesBL₀, BL₁, through to BL_(n−1), BL_(n) and a common source line CSL. Eachof the cell string 10 includes a plurality of memory cells 12 connectedin series. Gate electrodes of the memory cells 12 included in one cellstring 10 are respectively connected to word lines WL₀, WL₁, through toWL_(m−1), and WL_(m). A ground selection transistor 14 connected to aground selection line GSL is disposed on one end of each of the cellstrings 10 and a string selection transistor 16 connected to a stringselection line SSL is disposed on the other end of each of the cellstrings 10. The ground selection transistor 14 and the string selectiontransistor 16 control electrical connections between the memory cells 12and the bit lines BL₀, BL₁, through to BL_(n−1), and BL_(n) and thecommon source line CSL. The memory cells 12 connected to each of theword lines WL₀, WL₁, through to WL_(m−1), and WL_(m) across the cellstrings 10 form a page unit or a byte unit.

In the NAND flash memory device of FIGS. 1 and 2, in order to perform aread operation or a write operation by selecting a predetermined memorycell, the predetermined memory cell is selected by selecting the wordline WL₀, WL₁, through to WL_(m−1), and WL_(m) and the bit line BL₀,BL₁, through to BL_(n−1), and BL_(n) by using the X-decoder 110 and theY-decoder 120.

A NAND flash memory device has a high integration density since the NANDflash memory device has a structure in which a plurality of memory cellsare connected in series. However, recently, further reduction of thedesign rule of the NAND flash memory device is required in order toshrink the chip size. Also, as the design rule is reduced, the minimumpitch of patterns required for constituting the NAND flash memory deviceis also greatly reduced. In order to realize a minute pattern that meetsthe reduced design rule, various methods of forming patterns areemployed. In particular, in order to realize a cell array structure ofNAND flash memory devices that is difficult to realize using onlyexposure equipment and exposure technology that are provided by currentlithography techniques, a double patterning technique for repeatedlyforming a plurality of patterns by using a minute pitch that transcendsthe limits of conventional lithography techniques has been proposed.

In a conventional NAND flash memory device, a contact pad for connectingthe word lines WL₀, WL₁, through to WL_(m−1), and WL_(m) to theX-decoder 110 is integrally formed with the word lines WL₀, WL₁, throughto WL_(m−1), and WL_(m). The contact pad is formed at the same time aswhen the word lines WL₀, WL₁, through to WL_(m−1), and WL_(m) areformed. Thus, when the word lines WL₀, WL₁, through to WL_(m−1), andWL_(m) are formed using the double patterning technique, a trimmingprocess for removing undesired portions of fine patterns unnecessarilyformed around the contact pad for connection to a peripheral circuit isalso performed. The same trimming process is also applied to a case inwhich a contact pad for connecting the bit lines BL₀, BL₁, through toBL_(n−1), and BL_(n) to the Y-decoder 120 is integrally formed with thebit lines BL₀, BL₁, through to BL_(n−1), and BL_(n).

However, in such a conventional NAND flash memory device, aconfiguration of contact pads for peripheral circuit connectionsconnected to word lines and bit lines is minute and complicated, andthus, a layout of a mask pattern for this trimming process iscomplicated. In particular, the design rule of the NAND flash memorydevice is greatly reduced according to a recent market demand, andpattern sizes of word lines and bit lines that constitute the NAND flashmemory device are becoming more minute, and accordingly, theconfiguration of the contact pads for peripheral circuit connectionsconnected to the word lines and the bit lines become even more minuteand complicated. Thus, the layout of a mask pattern for a trimmingprocess is also minute and complicated. Also, since the pitch betweenminute patterns formed by the double patterning technique is very small,when a mask pattern for trimming is formed, a tolerance of an alignmenterror between the minute patterns formed by double patterning and themask pattern is very strict. Thus, due to the possibility ofmisalignment occurring during performance of an aligning process and dueto various parameters used in an etching process, problems such asremoval of patterns in necessary regions or generation of undesiredshapes of patterns after a trimming process may be generated.

SUMMARY OF THE INVENTION

The present invention provides a method of forming fine patterns of asemiconductor device, in which, when conductive lines for defining acell array region of the semiconductor device are integrally formed withcontact pads for connecting the conductive lines to a peripheralcircuit, fine conductive patterns designed at high density can be formedwith various pitches according to a reduced design rule by simplifying atrimming process for removing unnecessary portions.

According to an aspect of the present invention, there is provided amethod of forming fine patterns of a semiconductor device. In thismethod, first, a mold mask pattern block is formed by arranging aplurality of mold mask patterns parallel to each other within a cellblock on a substrate comprising a film which is to be etched, whereineach of the mold mask patterns comprises a first portion extending in afirst direction and a second portion which is integrally formed with thefirst portion and extends in a second direction different from the firstdirection. Then, a first mask layer covering sidewalls and an uppersurface of each of the plurality of mold mask patterns is formed on thesubstrate. Thereafter, first mask patterns are formed by partiallyremoving the first mask layer so that a first area of the first masklayer remains and a second area of the first mask layer is removed,wherein the first area of the first mask layer covers sidewalls ofadjacent mold mask patterns from among the plurality of mold maskpatterns by being located between the adjacent mold mask patterns, andthe second area of the first mask layer covers portions of the sidewallsof the plurality of mold mask patterns, the portions corresponding to anoutermost sidewall of the mold mask pattern block.

The first mask layer may comprise two vertical extensions coveringsidewalls of the adjacent mold mask patterns by being located betweenthe adjacent mold mask patterns and a horizontal extension formed on thefilm to be etched between the two vertical extensions so that the twovertical extensions are connected to each other.

In an embodiment, the forming of the first mask patterns may compriseforming a plurality of mask spacers covering sidewalls of the pluralityof mold mask patterns by removing the horizontal extensions by etchingback the first mask layer after forming the first mask layer; forming agap-fill protection film that fills gaps between adjacent mask spacerswhich exist between the adjacent mold mask patterns; removing portionsof the plurality of mask spacers, which are not covered by the gap-fillprotection film; and removing the gap-fill protection film.

In another embodiment, after the first mask layer is formed, recesseshaving widths each defined by two vertical extensions connected to ahorizontal extension of the first mask layer may be formed on thehorizontal extension between adjacent mold mask patterns of theplurality of mold mask patterns. In this embodiment, the forming of thefirst mask patterns may comprise forming the gap-fill protection filmwhich fills the recesses by being located between the two adjacent moldmask patterns, after the first mask layer is formed; removing a portionof the first mask layer, which is not covered by the gap-fill protectionfilm; and removing the gap-fill protection film. In this embodiment, themethod may further comprise removing the horizontal extensions of thefirst mask layer so that the film that is to be etched is exposedbetween the adjacent vertical extensions connected to each of thehorizontal extensions, after the gap-fill protection film is removed.

In another embodiment, after the first mask layer is formed, recesseshaving widths each defined by two vertical extensions connected to ahorizontal extension of the first mask layer may be formed on thehorizontal extension between adjacent mold mask patterns of theplurality of mold mask patterns. In this embodiment, the forming of thefirst mask patterns may comprise forming the gap-fill protection filmwhich fills the recesses by being located between the two adjacent moldmask patterns, after the first mask layer is formed; removing a portionof the first mask layer, which is not covered by the gap-fill protectionfilm; forming mask spaces each having a first depth between the moldmask patterns and the gap-fill protection film, by partially removingthe vertical extensions of the mask layer starting from upper surfacesof the vertical extensions, when the gap-fill protection film remains inthe recesses; and forming upper mask patterns within the mask spaces. Inthe forming of the mask spaces, the vertical extensions of the firstmask layer may be removed so that a distance from the substrate to abottom surface of each of the mask spaces is greater than a distancefrom the substrate to a bottom surface of the gap-fill protection film.The upper mask patterns may be formed of a material different frommaterials used to form the mold mask patterns, the gap-fill protectionfilm, and the mask layer.

The method may further comprise forming second mask patterns comprisingfirst local patterns and second local patterns on the substrate afterthe first mask patterns are formed, wherein the first local patterns donot cover the first mask patterns and the second mask patterns cover thefirst mask patterns.

The substrate may comprise a memory cell region, a peripheral circuitregion, and a contact region located between the memory cell region andthe peripheral circuit region. The first local patterns of the secondmask patterns may be formed in the memory cell region and the peripheralcircuit region. The second local patterns of the second mask patternsmay be formed in the contact region.

The method may further comprise completely removing the plurality ofmold mask patterns after the first mask patterns are formed but beforethe second mask patterns are formed.

The method may further comprise etching the film that is to be etched,by using the first and second mask patterns as an etch mask.

The first mask patterns may be comprised of a plurality of mask spacersthat cover sidewalls of adjacent mold mask patterns of the plurality ofmold mask patterns by being located between the adjacent mold maskpatterns. Adjacent mask spacers between the adjacent mold mask patternsmay be separated apart from each other by having a space exposing thefilm that is to be etched between the adjacent mask spacers. In thiscase, in order to form N mask spacers (where N is a natural number)within the cell block in the forming of the first mask patterns, a moldmask pattern block comprising {(N+2)/2} mold mask patterns may be formedwithin the cell block in the forming of the mold mask pattern block.

According to another aspect of the present invention, there is provideda method of forming fine patterns of a semiconductor device, the methodcomprising arranging a plurality of mold mask patterns parallel to eachother on a substrate comprising a film which is to be etched, whereineach of the plurality of mold mask patterns comprises a first portionextending in a first direction and a second portion which is integrallyformed with the first portion and extends in a second directiondifferent from the first direction; forming a plurality of loop-shapedmask spacers covering sidewalls of the plurality of mold mask patternsso as to be separated from each other; and forming first mask patternsby partially removing the plurality of mask spacers so that sidewalls ofportions of the plurality of mold mask patterns, not facing other moldmask patterns, are exposed.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent by describing in detail exemplary embodimentsthereof with reference to the attached drawings in which:

FIG. 1 is a block diagram of a memory cell array of a conventional NANDflash memory device and peripheral circuits of the memory cell array;

FIG. 2 is a circuit diagram of a structure of the memory cell array ofthe conventional NAND flash memory device;

FIG. 3 is a plan view of a structure of a part of a semiconductor devicethat can be realized according to a method of forming fine patterns of asemiconductor device, according to an embodiment of the presentinvention;

FIGS. 4A through 4K are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device illustrated in FIG. 3,according to a first embodiment of the present invention;

FIGS. 5A through 5F are plan views of layouts of a major part of thesemiconductor device of FIG. 3 that are explained in processes of FIGS.4A through 4K;

FIGS. 6A through 6F are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a second embodiment of the present invention;

FIGS. 7A and 7B are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a third embodiment of the present invention; and

FIGS. 8A through 8I are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is described more fully hereinafter with referenceto the accompanying drawings, in which example embodiments of theinvention are shown. The present invention may, however, be embodied inmany different forms and should not be construed as limited to theexample embodiments set forth herein. Rather, these example embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the scope of the present invention to those skilled inthe art. In the drawings, the sizes and relative sizes of layers andregions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” “coupled to” or “responsive to” anotherelement or layer, it can be directly on, connected, coupled orresponsive to the other element or layer or intervening elements orlayers may be present. In contrast, when an element is referred to asbeing “directly on,” “directly connected to,” “directly coupled to” or“directly responsive to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations (mixtures) of one or more of the associated listeditems and may be abbreviated as “/”.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The structure and/or the device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Example embodiments of the present invention are described herein withreference to cross-section illustrations that are schematicillustrations of idealized embodiments (and intermediate structures) ofthe present invention. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, example embodiments of thepresent invention should not be construed as limited to the particularshapes of regions illustrated herein but are to include deviations inshapes that result, for example, from manufacturing. For example, animplanted region illustrated as a rectangle will, typically, haverounded or curved features and/or a gradient of implant concentration atits edges rather than a binary change from implanted to non-implantedregion. Likewise, a buried region formed by implantation may result insome implantation in the region between the buried region and thesurface through which the implantation takes place. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the actual shape of a region of a device andare not intended to limit the scope of the present invention.

It should also be noted that in some alternate implementations, thefunctionality of a given block may be separated into multiple blocksand/or the functionality of two or more blocks may be at least partiallyintegrated.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present invention belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent application, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein. FIG. 3 is a planview of a structure of a part of a semiconductor device that can berealized according to a method of forming fine patterns of asemiconductor device, according to an embodiment of the presentinvention. In FIG. 3, layouts of a part of a memory cell region 300A ofa NAND flash memory device, a part of a contact region 300B forconnecting a plurality of conductive lines that define a cell array ofthe memory cell region 300A, for example, word lines and bit lines, toan external circuit (not shown) such as a decoder, and a part of aperipheral circuit region 300C are illustrated.

Referring to FIG. 3, a plurality of memory cell blocks 340 are formed inthe memory cell region 300A. However, only one memory cell block 340 isillustrated in FIG. 3. In the memory cell block 340, a plurality ofconductive lines 301-332 constitute a single cell string 10 (see FIG. 2)and extend parallel to each other in a first direction (i.e., an xdirection) between a string selection line SSL and a ground selectionline GSL. The conductive lines 301-332 extend across the memory cellregion 300A and the contact region 300B.

In order to connect the conductive lines 301-332 to an external circuit(not shown) such as a decoder, a plurality of contact pads 352 areintegrally formed with the conductive lines 301-332 within the contactregion 300B in such a way that each of the contract pads 352 isconnected to an end of a corresponding one of the conductive lines301-332.

In the contact region 300B, respective ends of the conductive lines301-332 extend up to the contact pads 352 in a direction other than thedirection in which the conductive lines 301-332 extend in the memorycell region 300A. As illustrated in FIG. 3, the respective ends of theconductive lines 301-332 within the contact region 300B extend in asecond direction (i.e., a y direction of FIG. 3) perpendicular to thefirst direction. However, the present invention is not limited to theconfiguration illustrated in FIG. 3. Various modifications and changesin the configurations of the conductive lines 301-332 and the contactpads 352 may be made within the scope of the present invention.

In the peripheral circuit region 300C, a conductive pattern 372 forperipheral circuits is formed.

In FIG. 3, the conductive lines 301-332, the string selection line SSL,the ground selection line GSL, the contact pads 352, and the conductivepattern 372 for peripheral circuits are all formed of an identicalmaterial. The conductive lines 301-332 may be word lines that define aplurality of memory cells in the memory cell region 300A. The conductivepattern 372 for peripheral circuits may constitute a gate electrode of aperipheral circuit transistor. The string selection line SSL and theground selection line GSL may have widths W2 and W3, respectively, whichare greater than a width W1 of each of the conductive lines 301-332.

Alternatively, the conductive lines 301-332 may be bit lines that definethe memory cells in the memory cell region 300A. In this case, thestring selection line SSL and the ground selection line GSL may beomitted.

Although FIG. 3 illustrates that the single memory cell block 340includes 32 conductive lines, namely, the conductive lines 301-332, thememory cell block 340 may include a different number of conductivelines.

Methods of forming fine patterns of the semiconductor device illustratedin FIG. 3, according to various exemplary embodiments of the presentinvention, will now be described in detail.

FIGS. 4A through 4K are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a first embodiment of the present invention.

FIGS. 5A through 5F are plan views of layouts of a major part of thesemiconductor device of FIG. 3, which is explained in processes of FIGS.4A through 4K. FIGS. 5A through 5F illustrate only the single memorycell block 340 of FIG. 3.

FIGS. 4A through 4K illustrate cross-sections taken along lines A-A′,B-B′, C-C′, and D-D′ of FIG. 3, according to a process sequence. InFIGS. 4A through 4K and FIGS. 5A through 5F, the same referencecharacters as those of FIG. 3 denote like elements, and thus theirdescription will be omitted. In FIGS. 4A through 4K, the memory cellregion 300A is represented as “CELL”, the contact region 300B isrepresented as “CONTACT”, and the peripheral circuit region 300C isrepresented as “PERI”.

Referring to FIGS. 4A and 5A, first, a substrate 500, for example, asilicon substrate, including the memory cell region 300A, the contactregion 300B, and the peripheral circuit region 300C is prepared.

A conductive layer 530 required to form the conductive lines is formedon the substrate 500. A first hard mask layer 532 and a second hard masklayer 534 are sequentially formed on the conductive layer 530. In somecases, one of the first and second hard mask layers 532 and 534 may beomitted. Alternatively, another layer in addition to the first hard masklayer 532 and the second hard mask layer 534 may be further formed.

Thereafter, in the memory cell region 300A and the contact region 300B,a plurality of mold mask patterns 540 are formed on the second hard masklayer 534. In FIG. 5A, a single mold mask pattern block 540A required toform the single memory cell block 340 (see FIG. 3) is illustrated.

When word lines are formed from the conductive layer 530, the conductivelayer 530 may be a stack of a tunneling oxide film, a charge storagelayer, a blocking oxide film, and a gate electrode layer sequentiallyformed on the substrate 500. In this case, the tunneling oxide film maybe a silicon oxide film. The charge storage layer may be a siliconnitride film, or a high-k film that has a higher dielectric constantthan the silicon nitride film. For example, the charge storage layer maybe a Si₃N₄ film, a metal oxide film, a metal nitride film, or acombination of two or more of these films. The blocking oxide film maybe formed of at least one of Al₂O₃, SiO₂, HfO₂, ZrO₂, LaO, LaAlO, LaHfO,and HfAlO. The gate electrode layer may be formed of TaN, TiN, W, WN,HfN, tungsten silicide, or a combination of two or more of thesematerials. Alternatively, when word lines are formed from the conductivelayer 530, the conductive layer 530 may be a stack of a tunneling oxidefilm, a conductive layer for floating gates, an inter-gate dielectricfilm, and a conductive layer for control gates sequentially formed onthe substrate 500. The first hard mask layer 532 may be a siliconnitride film.

On the other hand, when bit lines are formed from the conductive layer530, the conductive layer 530 may be formed of doped polysilicon ormetal.

The first hard mask layer 532 may be formed of an oxide film, and thesecond hard mask layer 534 may be formed of a polysilicon film. Forexample, the first hard mask layer 532 may be formed to a thickness ofabout 1000˜3000 Å. The second hard mask layer 534 may be formed to athickness of about 300˜1000 Å.

As illustrated in FIG. 5A, the single mold mask pattern block 540Aincludes a plurality of mold mask patterns 540. When the single memorycell block 340 desires to form N conductive lines, {(N+2)/2} mold maskpatterns 540 are included in the mold mask pattern block 540A. Forexample, when the single memory cell block 340 forms 32 conductive linesas illustrated in FIG. 3, 17 mold mask patterns 540_1-540_17 may beformed as the mold mask patterns 540 that constitute the single moldmask pattern block 540A.

As illustrated in FIG. 5A, the 17 mold mask patterns 540 extend from thememory cell region 300A to the contact region 300B. Each of the moldmask patterns 540 includes a first portion 542 extending in a firstdirection (i.e., an x direction in FIG. 5A) across the memory cellregion 300A and the contact region 300B, and a second portion 544 whichis formed only in the contact region 300B and extends in anotherdirection other than the first direction, for example, a seconddirection (i.e., a y direction in FIG. 5A) perpendicular to the firstdirection. In the mold mask patterns 540, the second portion 544extending in a direction (i.e., the x direction in FIG. 5A)perpendicular to the second direction is wider than the first portion542 extending in a direction (i.e., the y direction in FIG. 5A)perpendicular to the first direction.

When the second hard mask layer 534 is formed of a polysilicon film, themold mask patterns 540 may be formed of a material having etchingselectivity with respect to the second hard mask layer 534, for example,oxide or nitride.

In order to form the mold mask patterns 540, an etching process in whicha photoresist pattern (not shown) formed by typical photolithography isused as an etch mask may be used.

Referring to FIG. 4B, a mask layer 550, covering top surfaces and sidewalls of the mold mask patterns 540, is formed on the resultantsubstrate 500 on which the mold mask patterns 540 have been formed.

The mask layer 550 of uniform thickness may be formed to cover the topsurfaces and side walls of the mold mask patterns 540. In the memorycell region 300A and the contact region 300B, a plurality of recesses552 may be formed on an upper surface of the mask layer 550 in betweenthe mold mask patterns 540, within a space defined by two outermost moldmask patterns 540_1 and 540_17 from among the mold mask patterns 540that constitute the single mold mask pattern block 540A. However, norecesses 552 are formed on the upper surface of the mask layer 550, onthe outside OUT of the two outermost mold mask patterns 540_1 and540_17.

When the second hard mask layer 534 is formed of polysilicon and themold mask pattern 540 is formed of oxide, the mask layer 550 may beformed of nitride. On the other hand, when the second hard mask layer534 is formed of polysilicon and the mold mask pattern 540 is formed ofnitride, the mask layer 550 may be formed of oxide.

Referring to FIGS. 4C and 5B, a plurality of loop-shaped mask spacers550 a covering sidewalls of the mold mask patterns 540 are formed byetching the mask layer 550.

Consequently, two mask spacers 550 a extending along respectivesidewalls of two adjacent mold mask patterns 540 and separated from eachother exist in between the two adjacent mold mask patterns 540, withinthe space defined by the two outermost mold mask patterns 540_1 and540_17 from among the mold mask patterns 540 that constitute the singlemold mask pattern block 540A.

Referring to FIG. 4D, a gap-fill protection film 560 is formed on theresultant substrate 500 on which the mold mask patterns 540 and the maskspacers 550 a have been formed. The gap-fill protection film 560completely covers exposed portions of the mold mask patterns 540, themask spacers 550 a, and the second hard mask layer 534, while alsofilling gaps between the mask spacers 550 a including the recesses 552illustrated in FIG. 4B.

The gap-fill protection film 560 may be formed of the same material asused to form the mold mask patterns 540. Alternatively, the gap-fillprotection film 560 may be formed of a material which is different fromthat used to form the mold mask patterns 540 but has etchingcharacteristics similar to those of the mold mask patterns 540. When themask spacers 550 a are formed of nitride, the mold mask patterns 540 andthe gap-fill protection film 560 may be formed of oxide. On the otherhand, when the mask spacers 550 a are formed of oxide, the mold maskpatterns 540 and the gap-fill protection film 560 may be formed ofnitride.

Referring to FIGS. 4E and 5C, outermost portions B of mask spacers 550 athat cover portions of the mold mask patterns 540, which provideoutermost sidewalls A of the single mold mask pattern block 540A (seeFIG. 5A), constituting the single mold mask pattern block 540A areexposed. The single mold mask pattern block 540A is required to form thesingle memory cell block 340 (see FIG. 3).

In order to expose the outermost portions B, the gap-fill protectionfilm 560 is isotropically etched until the outermost portions B of themask spacers 550 a covering portions of the mold mask patterns 540,which provide the outermost sidewalls A of the single mold mask patternblock 540A, and the upper surfaces of the mold mask patterns 540constituting the single mold mask pattern block 540A are exposed. Theisotropical etching of the gap-fill protection film 560 is performedwith the gap-fill protection film 560 completely exposed, and specialevaporation or photolithography for forming an etch mask is notperformed. The isotropical etching may be wet or dry etching.

Consequently, the gap-fill protection film 560 remains only in gapsbetween the mask spacers 550 a in a space between two adjacent mold maskpatterns 540.

Referring to FIGS. 4F and 5D, the outermost sidewalls A of the singlemold mask pattern block 540A (see FIG. 5A), namely, the portions of themold mask patterns 540 corresponding to the outermost sidewalls A of thesingle mold mask pattern block 540A, are exposed.

FIG. 5D illustrates that sidewalls of end portions of the mold maskpatterns 540, which are located in the contact region 300B, are exposed.Although not shown in FIG. 5D, sidewalls of end portions of the moldmask patterns 540, which are located in the memory cell region 300A, arealso exposed as a result of the isotropical etching.

In order to expose the outermost sidewalls A, exposed portions of themask spacers 550 a are isotropically etched. At this time, specialphotolithography for forming an etch mask is not performed. Theisotropical etching may be wet or dry etching. As a result of theisotropical etching, portions of the sidewalls of the mold mask patterns540, not facing other mold patterns 540, are exposed.

Since the outermost sidewalls A of the mold mask patterns 540 areexposed by etching the exposed portions of the mask spacers 550 a, asingle mask spacer 550 a surrounding a single mold mask pattern 540within the mold mask pattern block 540A is halved. Consequently, aneffect whereby unnecessary portions of the mask spacers 550 a aretrimmed around contact pads for peripheral circuit connections withinthe contact region 300B (see FIG. 3) is obtained.

Referring to FIGS. 4G and 5E, under a condition that etching of thesecond hard mask layer 534 and the mask spacers 550 a is suppressed, themold mask patterns 540 and the gap-fill protection film 560 are etchedback so as to be completely removed. In order to remove the mold maskpatterns 540 and the gap-fill protection film 560, a dry or wet etchbackprocess may be used.

Referring to FIGS. 4H and 5F, local mask patterns 570 are formed withinthe memory cell region 300A, the contact region 300B, and the peripheralcircuit region 300C.

The local mask patterns 570 include a plurality of first local maskpatterns 570 a for forming a plurality of string selection lines SSL anda plurality of ground selection lines GSL within the memory cell region300A, a plurality of second local mask patterns 570 b for forming thecontact pads 352 within the contact region 300B, and a plurality ofthird local mask patterns 570 c (not shown in FIG. 5F) for forming unitelements required to constitute a peripheral circuit, for example, theconductive patterns 372 for peripheral circuits of FIG. 3, within theperipheral circuit region 300C. Although not shown in the drawings, thelocal mask patterns 570 may further include a fourth local mask pattern(not shown) for forming a photomask alignment key on the substrate 500.In some cases, the fourth local mask pattern may be formed at a desiredlocation on the substrate 500, for example, in the contact region 300B,the peripheral circuit region 300C, or other locations. In some cases,the local mask patterns 570 may be formed on areas having no mask spacer550 a formed thereon, in the memory cell region 300A and the peripheralcircuit region 300C. Alternatively, the local mask patterns 570 may beformed on the mask spacers 550 a within the contact region 300B.

The local mask patterns 570 may be photoresist patterns formed bytypical photolithography. Alternatively, each of the local mask patterns570 may be a stack of a carbon-contained film pattern, an SiON pattern,and a photoresist pattern. A case where the local mask patterns 570 arestack structures will be described later in greater detail withreference to FIG. 8H, in which a process of forming local mask patterns870 is illustrated.

Referring to FIG. 4I, in the memory cell region 300A, the contact region300B, and the peripheral circuit region 300C on the substrate 500, thesecond hard mask layer 534 is etched using the mask spacers 550 a andthe local mask patterns 570 as an etch mask, thereby forming second hardmask patterns 534 a.

As illustrated in FIG. 4I, the local mask patterns 570 may be completelyremoved from the substrate 500 during the etching process for formingthe second hard mask patterns 534 a. However, the local mask patterns570 may not be completely removed from the substrate 500, and in thisstate a subsequent process may be performed.

Referring to FIG. 4J, in the memory cell region 300A, the contact region300B, and the peripheral circuit region 300C on the substrate 500, thefirst hard mask layer 532 is etched using the second hard mask patterns534 a as an etch mask, thereby forming first hard mask patterns 532 a.

Referring to FIG. 4K, in the memory cell region 300A, the contact region300B, and the peripheral circuit region 300C on the substrate 500, theconductive layer 530 is etched using the first hard mask patterns 532 aas an etch mask, thereby forming a plurality of first conductive lines530 a for forming a cell array and a plurality of second conductivelines 530 b for forming a string selection line SSL and a groundselection line GSL on the substrate 500 within the memory cell region300A. Simultaneously with the formations of the first and secondconductive lines 530 a and 530 b, a plurality of contact pads 530 cintegrally connected with the first conductive lines 530 a are formed inthe contact region 300B, and conductive patterns 530 d for peripheralcircuits are formed in the peripheral circuit region 300C.

The first conductive lines 530 a formed within the memory cell region300A may correspond to the conductive lines 301, 302, through to 332illustrated in FIG. 3, and the second conductive lines 530 b formedwithin the memory cell region 300A may correspond to the stringselection line SSL and the ground selection line GSL illustrated in FIG.3. The contact pads 530 c, which are integrally connected with the firstconductive lines 530 a, formed within the contact region 300B maycorrespond to the contact pads 352 illustrated in FIG. 3. The conductivepatterns 530 d for peripheral circuits formed in the peripheral circuitregion 300C may correspond to the conductive patterns 372 for peripheralcircuits illustrated in FIG. 3.

FIGS. 6A through 6F are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a second embodiment of the present invention.

In FIGS. 6A through 6F, the same reference characters as those of FIGS.3, 4A through 4K, and 5A through 5F denote like elements, and thus theirdescription will be omitted.

Referring to FIG. 6A, in a method as described above with reference toFIGS. 4A, 5A, and 4B, the conductive layer 530, the first hard masklayer 532, and the second hard mask layer 534 are sequentially formed onthe substrate 500, and the mold mask patterns 540 and the mask layer 550are then formed on the second hard mask layer 534.

Thereafter, the gap-fill protection film 560 is formed on the mask layer550.

The gap-fill protection film 560 may be formed according to a processsimilar to that described above with reference to FIG. 4D. In otherwords, the gap-fill protection film 560 may be formed to completelycover the mask layer 550 while filling the recesses 552 formed on theupper surface of the mask layer 550 between two adjacent mold maskpatterns 540.

Referring to FIG. 6B, in a method similar to that described above withreference to FIGS. 4E and 5C, outermost portions C of the mask layer 550that cover the portions of the mold mask patterns 540, which provide theoutermost sidewalls A of the single mold mask pattern block 540A,constituting the single mold mask pattern block 540A are exposed. Thesingle mold mask pattern block 540A is required to form the singlememory cell block 340 (see FIG. 3).

In order to expose the outermost portions C of the mask layer 550, thegap-fill protection film 560 is isotropically etched until the outermostportions C of the mask layer 550 covering portions of the mold maskpatterns 540, which provide the outermost sidewalls A of the single moldmask pattern block 540A, and the upper surfaces of the mold maskpatterns 540 constituting the single mold mask pattern block 540A areexposed. The isotropical etching may be wet or dry etching.

Consequently, the gap-fill protection film 560 remains only in therecesses 552 between two adjacent mold mask patterns 540.

Referring to FIG. 6C, in a method similar to that described above withreference to FIGS. 4F and 5D, the outermost sidewalls A of the singlemold mask pattern block 540A, namely, the portions of the mold maskpatterns 540 corresponding to the outermost sidewalls A of the singlemold mask pattern block 540A, are exposed.

In order to expose the outermost sidewalls A, an exposed portion of themask layer 550 is isotropically etched. The isotropical etching may bewet or dry etching.

Since the outermost sidewalls A of the mold mask patterns 540 areexposed by etching the exposed portion of the mask layer 550, the masklayer 550 surrounding a single mold mask pattern 540 within the moldmask pattern block 540A is cut away at the outermost sidewalls A.Consequently, an effect whereby an unnecessary portion of the mask layer550 is trimmed around contact pads for peripheral circuit connectionswithin the contact region 300B (see FIG. 3) is obtained.

After the outermost sidewalls A of the mold mask patterns 540 areexposed, a plurality of butted mask pattern pairs 550 b havingcross-sections that are roughly “U” shaped are formed between adjacenttwo mold mask patterns 540 by portions of the mask layer 550 remainingwithin the mold mask pattern block 540A. Each of the butted mask patternpairs 550 b includes two vertical extensions 550 v (see FIG. 6D)covering respective sidewalls of two adjacent mold mask patterns 540 ofthe mold mask pattern block 540A, and a horizontal extension 550 h (seeFIG. 6D) connecting the two vertical extensions 550 v to each other.

Referring to FIG. 6D, in a method similar to that described above withreference to FIGS. 4G and 5E, under a condition that etching of thesecond hard mask layer 534 and the butted mask pattern pairs 550 b issuppressed, the mold mask patterns 540 and the gap-fill protection film560 are etched back so as to be completely removed. In order to removethe mold mask patterns 540 and the gap-fill protection film 560, a dryor wet etchback process may be used.

Consequently, only the butted mask pattern pairs 550 b remain on thesecond hard mask layer 534.

Referring to FIG. 6E, in a method similar to that described above withreference to FIGS. 4H and 5F, the local mask patterns 570 are formedwithin the memory cell region 300A, the contact region 300B, and theperipheral circuit region 300C.

The local mask patterns 570 include a plurality of first local maskpatterns 570 a for forming a plurality of string selection lines SSL anda plurality of ground selection lines GSL within the memory cell region300A, a plurality of second local mask patterns 570 b for forming thecontact pads 352 within the contact region 300B, and a plurality ofthird local mask patterns 570 c (not shown in FIG. 5F) for forming unitelements required to constitute a peripheral circuit, for example, theconductive patterns 372 for peripheral circuits of FIG. 3, within theperipheral circuit region 300C.

Referring to FIG. 6F, in a method similar to that described above withreference to FIG. 4I, in the memory cell region 300A, the contact region300B, and the peripheral circuit region 300C on the substrate 500, thesecond hard mask layer 534 is etched using the butted mask pattern pairs550 b and the local mask patterns 570 as an etch mask. However, in thepresent embodiment, while the second hard mask layer 534 is being etchedusing the butted mask pattern pairs 550 b and the local mask patterns570 as an etch mask, portions of the vertical extensions 550 v of thebutted mask pattern pairs 550 b are consumed, starting from the uppersurfaces thereof, and the horizontal extensions 550 h of the butted maskpattern pairs 550 b are also consumed in proportion to the amount ofconsumption of the vertical extensions 550 v. Consequently, a portion ofthe second hard mask layer 534 between the two vertical extensions 550 vof each of the butted mask pattern pairs 550 b is exposed. Thus, thesecond hard mask layer 534 is etched using the vertical extensions 550 vof the butted mask pattern pairs 550 b and the local mask patterns 570as an etch mask, thereby forming second hard mask patterns 534 a havinga structure as illustrated in FIG. 4I.

Similar to FIG. 4I, the local mask patterns 570 may be completelyremoved from the substrate 500 during the etching process for formingthe second hard mask patterns 534 a. However, the local mask patterns570 may not be completely removed from the second hard mask patterns 534a, and in this state a subsequent process may be performed.

Thereafter, in a method similar to that described above with referenceto FIGS. 4J and 4K, in the memory cell region 300A, the contact region300B, and the peripheral circuit region 300C on the substrate 500, thefirst hard mask layer 532 is etched using the second hard mask patterns534 a as an etch mask, thereby forming first hard mask patterns 532 a.Also, in the memory cell region 300A, the contact region 300B, and theperipheral circuit region 300C on the substrate 500, the conductivelayer 530 is etched using the first hard mask patterns 532 a as an etchmask, thereby forming a plurality of first conductive lines 530 a forforming a cell array and a plurality of second conductive lines 530 bfor forming a string selection line SSL and a ground selection line GSLon the substrate 500 within the memory cell region 300A. Simultaneouslywith the formations of the first and second conductive lines 530 a and530 b, a plurality of contact pads 530 c integrally connected with thefirst conductive lines 530 a are formed in the contact region 300B, andconductive patterns 530 d for peripheral circuits are formed in theperipheral circuit region 300C.

FIGS. 7A and 7B are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a third embodiment of the present invention.

In FIGS. 7A and 7B, the same reference characters as those of FIGS. 3,4A through 4K, 5A through 5F, and 6A through 6F denote like elements,and thus their description will be omitted.

Referring to FIG. 7A, in a method similar to that described above withreference to FIGS. 6A through 6D, the conductive layer 530, the firsthard mask layer 532, and the second hard mask layer 534 are sequentiallyformed on the substrate 500, and a plurality of butted mask patternpairs 550 b are then formed on the second hard mask layer 534.

Thereafter, the butted mask pattern pairs 550 b are entirely etched backuntil the horizontal extensions 550 h of the butted mask pattern pairs550 b are completely removed. Thus, portions of the upper surface of thesecond hard mask layer 534, which are located below the horizontalextensions 550 h of the butted mask pattern pairs 550 b, are exposed.

As the horizontal extensions 550 h of the butted mask pattern pairs 550b are removed, portions of the vertical extensions 550 v of the buttedmask pattern pairs 550 b are consumed starting from the upper surfacesthereof. Thus, mask patterns 550 c made up of portions of the verticalextensions 550 v of the butted mask pattern pairs 550 b remaining afterthe consumption are formed on the second hard mask layer 534.

Referring to FIG. 7B, in a method similar to that described above withreference to FIG. 6E or 4H and FIG. 5F, the local mask patterns 570 areformed in the memory cell region 300A, the contact region 300B, and theperipheral circuit region 300C.

Thereafter, as in the process described above with reference to FIG. 6For the processes described above with reference to FIGS. 4I, 4J, and 4K,in the memory cell region 300A, the contact region 300B, and theperipheral circuit region 300C on the substrate 500, the second hardmask layer 534 is etched using the mask patterns 550 c and the localmask patterns 570 as an etch mask, thereby forming the second hard maskpatterns 534 a. The first hard mask layer 532 is etched using the secondhard mask patterns 534 a as an etch mask, thereby forming the first hardmask patterns 532 a. The conductive layer 530 is etched using the firsthard mask patterns 532 a as an etch mask, thereby forming a plurality offirst conductive lines 530 a for forming a cell array and a plurality ofsecond conductive lines 530 b for forming a string selection line SSLand a ground selection line GSL on the substrate 500 within the memorycell region 300A. Simultaneously with the formations of the first andsecond conductive lines 530 a and 530 b, a plurality of contact pads 530c integrally connected with the first conductive lines 530 a are formedin the contact region 300B, and conductive patterns 530 d for peripheralcircuits are formed in the peripheral circuit region 300C.

FIGS. 8A through 8I are cross-sectional views for explaining a method offorming fine patterns of the semiconductor device of FIG. 3, accordingto a fourth embodiment of the present invention.

In FIGS. 8A through 8I, the same reference characters as those of FIGS.3, 4A through 4K, 5A through 5F, and 6A through 6F denote like elements,and thus their description will be omitted.

Referring to FIG. 8A, in a method as described above with reference toFIGS. 4A, 5A, and 4B, the conductive layer 530 and the first hard masklayer 532 are sequentially formed on the substrate 500, and the moldmask patterns 540 and the mask layer 550 are then formed on the firsthard mask layer 532.

In the present embodiment, formation of the second hard mask layer 534on the first hard mask layer 532 is omitted, and the mold mask patterns540 and the mask layer 550 are formed on the first hard mask layer 532.In this regard, the present embodiment differs from the embodiment ofFIGS. 4A and 4B.

Referring to FIG. 8B, in a method as described above with reference toFIG. 6A, the gap-fill protection film 560 is formed on the mask layer550.

Referring to FIG. 8C, in a method similar to that described above withreference to FIG. 6B, in order to expose the outermost portions C of themask layer 550, the gap-fill protection film 560 is isotropically etcheduntil the outermost portions C of the mask layer 550 covering portionsof the mold mask patterns 540, which provide the outermost sidewalls Aof the single mold mask pattern block 540A, and the upper surfaces ofthe mold mask patterns 540 constituting the single mold mask patternblock 540A, are exposed. Consequently, the gap-fill protection film 560remains only in the recesses 552 between two adjacent mold mask patterns540.

Referring to FIG. 8D, in a method similar to that described above withreference to FIG. 6C, in order to expose the outermost sidewalls A ofthe mold mask patterns 540, an exposed portion of the mask layer 550 isisotropically etched.

After the outermost sidewalls A of the mold mask patterns 540 areexposed, a plurality of butted mask pattern pairs 550 b havingcross-sections that are roughly “U” shaped are formed between adjacenttwo mold mask patterns 540 by portions of the mask layer 550 remainingwithin the mold mask pattern block 540A. Each of the butted mask patternpairs 550 b includes two vertical extensions 550 v covering respectivesidewalls of two adjacent mold mask patterns 540 of the mold maskpattern block 540A, and a horizontal extension 550 h connecting the twovertical extensions 550 v to each other. The upper surfaces of thevertical extensions 550 v of the butted mask pattern pairs 550 b areexposed between the mold mask patterns 540 and the gap-fill protectionfilm 560.

Referring to FIG. 8E, the vertical extensions 550 v of the butted maskpattern pairs 550 b are removed by a first depth D1 starting from theupper surfaces thereof, thereby forming mask spaces S each having thefirst depth D1 between the mold mask patterns 540 and the gap-fillprotection film 560.

In a resulting structure obtained by the process of FIG. 8E, the firstdepth D1 of each of the mask spaces S may be rendered to a thicknessless than a thickness D2 of the gap-fill protection film 560, and adistance from the substrate 500 to the bottom surface of each of themask spaces S may be rendered greater than a distance from the substrate500 to the bottom surface of the gap-fill protection film 560. This isbecause when the first depth D1 is equal to or greater than thethickness D2 of the gap-fill protection film 560, the gap-fillprotection film 560 may collapse without maintaining its shape.

In order to remove the vertical extensions 550 v by the first depth D1starting from the upper surfaces thereof, a wet-etching or dry-etchingprocess may be used. For example, when the butted mask pattern pairs 550b are formed of nitride, the vertical extensions 550 v may be removed bythe first depth D1 starting from the upper surfaces thereof by using awet-etching process using a phosphoric acid solution as an etchsolution.

Referring to FIG. 8F, the second hard mask layer 834 is formed on themold mask patterns 540, the gap-fill protection film 560, and the buttedmask pattern pairs 550 b.

The second hard mask layer 834 completely covers the mold mask patterns540 and the gap-fill protection film 560 while completely filling maskspaces S between the mold mask patterns 540 and the gap-fill protectionfilm 560 over the vertical extensions 550 v of the butted mask patternpairs 550 b.

The second hard mask layer 834 is formed of a material having an etchingselectivity different from those of materials of the first hard masklayer 532, the mold mask pattern 540, the gap-fill protection film 560,and the butted mask pattern pairs 550 b. For example, when the firsthard mask layer 532, the mold mask pattern 540, and the gap-fillprotection film 560 are formed of oxide and the butted mask patternpairs 550 b are formed of nitride, the second hard mask layer 834 may beformed of polysilicon.

Referring to FIG. 8G, by isotropically etching the second hard masklayer 834, portions of the mold mask patterns 540, which provideoutermost sidewalls A of the single mold mask pattern block 540A,constituting the single mold mask pattern block 540A are exposed, andupper surfaces of the mold mask patterns 540 and the gap-fill protectionfilm 560 are simultaneously exposed. The isotropical etching may be wetor dry etching.

Consequently, in the memory cell region 300A and the contact region 300Bon the substrate 500, a plurality of second hard mask patterns 834 awith which the mask spaces S between the mold mask patterns 540 and thegap-fill protection film 560 are filled, are formed.

Referring to FIG. 8H, in a method similar to that of forming the localmask patterns 570 described above with reference to FIG. 6E, local maskpatterns 870 are formed within the memory cell region 300A, the contactregion 300B, and the peripheral circuit region 300C.

The local mask patterns 870 include a plurality of first local maskpatterns 870 a for forming a plurality of string selection lines SSL anda plurality of ground selection lines GSL within the memory cell region300A, a plurality of second local mask patterns 870 b for forming thecontact pads 352 within the contact region 300B, and a plurality ofthird local mask patterns 870 c for forming unit elements required toconstitute a peripheral circuit, for example, the conductive patterns372 for peripheral circuits of FIG. 3, within the peripheral circuitregion 300C.

For example, each of the local mask patterns 870 may be a stack of acarbon-contained film pattern 872, an SiON pattern 874, and aphotoresist pattern 876 which are formed by coating. In order to formthese local mask patterns 870, the following process may be performed.First, after a carbon-contained film is formed on a resultant structureof FIG. 8G, on which the second hard mask patterns 834 a have beenformed, by spin coating, an SiON film is formed to a thickness of about100˜500 Å on the carbon-contained film, and the photoresist pattern 876is formed on the SiON film. Thereafter, the SiON pattern 874 and thecarbon-contained film pattern 872 are formed by sequentially etching theSiON film and the carbon-contained film using the photoresist pattern876 as an etch mask. The SiON film may serve as an anti-reflective filmand may also serve as a hard mask when an underlayer below the SiON filmis etched.

The carbon-contained film pattern 872 may be obtained from an organiccompound comprised of a hydrocarbon compound including aromatic rings orits derivative. For example, the carbon-contained film pattern 872 maybe obtained from a material having a high carbon content, that is, about85˜99% by weight of carbon based on a total weight of an organicmaterial made up of an organic compound including aromatic rings such asphenyl, benzene, or naphthalene. In the process of forming thecarbon-contained film, after an organic compound composed of a materialas described above is spin coated to a thickness of about 1000˜5000 Å onthe resultant structure of FIG. 8G on which the second hard maskpatterns 834 a have been formed, an obtained organic compound layer isprimarily baked at a temperature of about 150˜350° C. to thereby formthe carbon-contained film. The primary baking may be performed for about60 seconds. Thereafter, the carbon-contained film is secondarily bakedat a temperature of about 300˜550° C. to be hardened. The secondarybaking may be performed for about 30˜300 seconds. As described above, byhardening the carbon-contained film according to a secondary bakingprocess, even when deposition is performed at a relatively hightemperature, that is, about 400° C. or greater in order to form anotherfilm, for example, the SiON film, on the carbon-contained film, thisevaporation does not adversely affect the carbon-contained film.

Referring to FIG. 8I, in the memory cell region 300A, the contact region300B, and the peripheral circuit region 300C on the substrate 500, theexposed mold mask patterns 540 and the exposed gap-fill protection film560 are anisotropically etched using the local mask patterns 870 and thesecond hard mask patterns 834 a as an etch mask. Then, portions of thehorizontal extensions 550 h of the butted mask pattern pairs 550 b andthe first hard mask layer 532 below the portions of the horizontalextensions, which are exposed by removing the mold mask patterns 540 andthe gap-fill protection film 560 by the above-described anisotropicaletching, are consecutively etched using the local mask patterns 870 andthe second hard mask patterns 834 a as an etch mask, thereby forming aplurality of first hard mask patterns 532 a.

During the etching process for forming the first hard mask patterns 532a, the photoresist patterns 876 and the SiON patterns 874 may bepartially or entirely consumed. The carbon-contained film patterns 872may be partially or entirely consumed.

Thereafter, after unnecessary films are removed when needed, theconductive layer 530 is etched using the first hard mask patterns 532 aas an etch mask in the memory cell region 300A, the contact region 300B,and the peripheral circuit region 300C on the substrate 500.Consequently, a plurality of first conductive lines 530 a for forming acell array and a plurality of second conductive lines 530 b for formingthe string selection line SSL and the ground selection line GSL areformed within the memory cell region 300A, a plurality of contact pads530 c integrally connected to the first conductive lines 530 a areformed within the contact region 300B, and conductive patterns 530 d forperipheral circuits are formed within the peripheral circuit region300C.

In a method of forming fine patterns of a semiconductor device accordingto the present invention, a plurality of conductive lines extendingparallel to each other in order to form a cell array of ahighly-integrated semiconductor device, and a plurality of contact padsintegrally connected with respective ends of the conductive lines in acontact region in order to connect the conductive lines to an externalcircuit such as a decoder are formed by etching a conductive layer belowmask spacers formed around a plurality of mold mask patterns by usingthe mask spacers as an etch mask. When trimming for removing unnecessaryportions of the mask spacers is performed, photolithography, whichrequires expensive equipment and mask patterns having a complicatedlayout, does not need to be performed. The mask spacer trimming may beachieved using a simple and economic process.

In addition, in the method of forming fine patterns of a semiconductordevice according to the present invention, in order to form the contactpads for peripheral circuit connections at ends of the conductive linessimultaneously with the formation of the conductive lines, first, moldmask patterns are formed to form etch mask patterns required to etch theconductive layer on a substrate. Then, spacers are formed on sidewallsof the mold mask patterns, and the conductive layer is then etched usingthe spacers as an etch mask to thereby form the conductive lines.Accordingly, a critical dimension may be uniformly obtained when finemask patterns are formed. Thus, when word lines of the semiconductordevice are formed from the conductive lines, gate channel lengths may beuniformly established over all of the word lines, and each memory cellcan uniformly control a threshold voltage.

Moreover, in the method of forming fine patterns of a semiconductordevice according to the present invention, {(N+2)/2} mold mask patternsare formed within a cell block constituting a single cell string, inorder to form N parallel conductive lines, namely, N mask spacers,within the cell block. For example, in order to form 32 parallelconductive lines on a substrate within a single cell block, 17 mold maskpatterns are first formed on the substrate. In other words, an evennumber of conductive lines are obtained regardless of whether either anodd or even number of mold mask patterns exist within the single cellblock. Therefore, when word lines in a memory cell array region areformed from the conductive lines, a layout capable of securing cells,the number of which is 2^(n) times the total number of word lines, maybe designed without needing to form unnecessary word lines on thesubstrate. Thus, an area on the substrate where the unnecessary wordlines are to be formed is reduced, leading to efficient utilization of avalid area on the substrate.

While the present invention has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the present invention as defined by the following claims.

1. A method of forming fine patterns of a semiconductor device, themethod comprising: forming a mold mask pattern block by arranging aplurality of mold mask patterns parallel to each other within a cellblock on a substrate comprising a film which is to be etched, whereineach of the mold mask patterns comprises a first portion extending in afirst direction and a second portion which is integrally formed with thefirst portion and extends in a second direction different from the firstdirection; forming a first mask layer covering sidewalls and an uppersurface of each of the plurality of mold mask patterns, on thesubstrate; and forming first mask patterns by partially removing thefirst mask layer so that a first area of the first mask layer remainsand a second area of the first mask layer is removed, wherein the firstarea of the first mask layer covers sidewalls of adjacent mold maskpatterns from among the plurality of mold mask patterns by being locatedbetween the adjacent mold mask patterns, and the second area of thefirst mask layer covers portions of the sidewalls of the plurality ofmold mask patterns, the portions corresponding to an outermost sidewallof the mold mask pattern block.
 2. The method of claim 1, wherein thefirst mask layer comprises two vertical extensions covering sidewalls ofthe adjacent mold mask patterns by being located between the adjacentmold mask patterns and a horizontal extension formed on the film to beetched between the two vertical extensions so that the two verticalextensions are connected to each other.
 3. The method of claim 1,wherein the forming of the first mask patterns comprises: forming aplurality of mask spacers covering sidewalls of the plurality of moldmask patterns by removing the horizontal extensions by etching back thefirst mask layer after forming the first mask layer; forming a gap-fillprotection film that fills gaps between adjacent mask spacers whichexist between the adjacent mold mask patterns; removing portions of theplurality of mask spacers, which are not covered by the gap-fillprotection film; and removing the gap-fill protection film.
 4. Themethod of claim 3, wherein the plurality of mold mask patterns areremoved together with the gap-fill protection film when the gap-fillprotection film is removed.
 5. The method of claim 4, wherein: the firstmask layer is formed of nitride; and the gap-fill protection film andthe plurality of mold mask patterns are formed of oxide.
 6. The methodof claim 3, further comprising etching the film which is to be etched byusing the plurality of mask spacers as an etch mask.
 7. The method ofclaim 2, wherein: after the first mask layer is formed, recesses havingwidths each defined by two vertical extensions connected to a horizontalextension of the first mask layer are formed on the horizontal extensionbetween adjacent mold mask patterns of the plurality of mold maskpatterns; and the forming of the first mask patterns comprises: formingthe gap-fill protection film which fills the recesses by being locatedbetween the two adjacent mold mask patterns, after the first mask layeris formed; removing a portion of the first mask layer, which is notcovered by the gap-fill protection film; and removing the gap-fillprotection film.
 8. The method of claim 7, wherein the plurality of moldmask patterns are removed together with the gap-fill protection filmwhen the gap-fill protection film is removed.
 9. The method of claim 7,further comprising removing the horizontal extensions of the first masklayer so that the film that is to be etched is exposed between theadjacent vertical extensions connected to each of the horizontalextensions, after the gap-fill protection film is removed.
 10. Themethod of claim 9, further comprising etching the film that is to beetched, by using the vertical extensions of the mask layer as an etchmask.
 11. The method of claim 2, wherein: after the first mask layer isformed, recesses having widths each defined by two vertical extensionsconnected to a horizontal extension of the first mask layer are formedon the horizontal extension between adjacent mold mask patterns of theplurality of mold mask patterns; and the forming of the first maskpatterns comprises: forming the gap-fill protection film which fills therecesses by being located between the two adjacent mold mask patterns,after the first mask layer is formed; removing a portion of the firstmask layer, which is not covered by the gap-fill protection film;forming mask spaces each having a first depth between the mold maskpatterns and the gap-fill protection film, by partially removing thevertical extensions of the mask layer starting from upper surfaces ofthe vertical extensions, when the gap-fill protection film remains inthe recesses; and forming upper mask patterns within the mask spaces.12. The method of claim 11, wherein in the forming of the mask spaces,the vertical extensions of the first mask layer are removed so that adistance from the substrate to a bottom surface of each of the maskspaces is greater than a distance from the substrate to a bottom surfaceof the gap-fill protection film.
 13. The method of claim 11, wherein theupper mask patterns are formed of a material different from materialsused to form the mold mask patterns, the gap-fill protection film, andthe mask layer.
 14. The method of claim 11, further comprising etchingthe mold mask patterns, the gap-fill protection film, and the horizontalextensions of the first mask layer by using the upper mask patterns asan etch mask.
 15. The method of claim 14, further comprising etching thefilm that is to be etched, by using the upper mask patterns as an etchmask.
 16. The method of claim 1, further comprising forming second maskpatterns comprising first local patterns and second local patterns onthe substrate after the first mask patterns are formed, wherein thefirst local patterns do not cover the first mask patterns and the secondmask patterns cover the first mask patterns.
 17. The method of claim 16,wherein: the substrate comprises a memory cell region, a peripheralcircuit region, and a contact region located between the memory cellregion and the peripheral circuit region; the first local patterns ofthe second mask patterns are formed in the memory cell region and theperipheral circuit region; and the second local patterns of the secondmask patterns are formed in the contact region.
 18. The method of claim16, further comprising completely removing the plurality of mold maskpatterns after the first mask patterns are formed but before the secondmask patterns are formed.
 19. The method of claim 16, wherein theforming of the second mask patterns comprises forming photoresistpatterns on the first mask patterns.
 20. The method of claim 16, whereinthe forming of the second mask patterns comprises: forming acarbon-contained film on each of the first mask patterns by spincoating; hardening the carbon-contained films by baking; and forming aphotoresist pattern on each of the carbon-contained films.
 21. Themethod of claim 20, further comprising forming an anti-reflective filmon each of the hardened carbon-contained films, before forming thephotoresist pattern on each of the carbon-contained films, wherein thephotoresist patterns are formed on the carbon-contained films.
 22. Themethod of claim 16, further comprising etching the film that is to beetched, by using the first and second mask patterns as an etch mask. 23.The method of claim 1, wherein the film that is to be etched comprises aconductive layer formed on the substrate.
 24. The method of claim 1,wherein the film that is to be etched comprises a conductive layer and ahard mask layer sequentially formed on the substrate.
 25. The method ofclaim 24, wherein the hard mask layer comprises a single layercomprising one of an oxide film, a nitride film, and a polysilicon film.26. The method of claim 24, wherein the hard mask layer comprises adouble layer comprising two of an oxide film, a nitride film, and apolysilicon film.
 27. The method of claim 16, wherein the forming of thesecond mask patterns uses photolithography.
 28. The method of claim 1,wherein photolithography is not used after the formation of the firstmask layer until the formation of the second mask patterns.
 29. Themethod of claim 1, wherein in the forming of the first mask patterns,the second area of the first mask layer is etched when the first area ofthe mask layer is covered with the gap-fill protection film.
 30. Themethod of claim 29, wherein dry etching is performed to form the firstmask patterns.
 31. The method of claim 29, wherein wet etching isperformed to form the first mask patterns.
 32. The method of claim 16,wherein: the first mask patterns are comprised of a plurality of maskspacers that cover sidewalls of adjacent mold mask patterns of theplurality of mold mask patterns by being located between the adjacentmold mask patterns; and adjacent mask spacers between the adjacent moldmask patterns are separated apart from each other by having a spaceexposing the film that is to be etched between the adjacent maskspacers.
 33. The method of claim 32, wherein to form N mask spacers(where N is a natural number) within the cell block in the forming ofthe first mask patterns, a mold mask pattern block comprising {(N+2)/2}mold mask patterns is formed within the cell block in the forming of themold mask pattern block.
 34. The method of claim 16, wherein the firstmask patterns comprise two vertical extensions that cover sidewalls ofadjacent mold mask patterns of the plurality of mold mask patterns bybeing located between the adjacent mold mask patterns, and a horizontalextension formed on the film that is to be etched between the twovertical extensions so that the two vertical extensions are connected toeach other.
 35. The method of claim 34, further comprising: forming maskspaces exposing sidewalls of the mold mask patterns by partiallyremoving the vertical extensions of the first mask patterns startingfrom upper surfaces of the vertical extensions, before forming thesecond mask patterns; and forming the upper mask patterns within themask spaces.
 36. The method of claim 35, wherein the plurality of moldmask patterns, the first mask patterns, the upper mask patterns, and thesecond mask patterns are formed of different materials.
 37. The methodof claim 35, further comprising etching the film that is to be etched,by using the upper mask patterns and the second mask patterns as an etchmask.
 38. The method of claim 1, wherein in the plurality of mold maskpatterns, widths of the second portions extending in a directionperpendicular to the second direction are greater than widths of thefirst portions extending in a direction perpendicular to the firstdirection.
 39. The method of claim 1, wherein the second direction isperpendicular to the first direction.
 40. A method of forming finepatterns of a semiconductor device, the method comprising: arranging aplurality of mold mask patterns parallel to each other on a substratecomprising a film which is to be etched, wherein each of the pluralityof mold mask patterns comprises a first portion extending in a firstdirection and a second portion which is integrally formed with the firstportion and extends in a second direction different from the firstdirection; forming a plurality of loop-shaped mask spacers coveringsidewalls of the plurality of mold mask patterns so as to be separatedfrom each other; and forming first mask patterns by partially removingthe plurality of mask spacers so that sidewalls of portions of theplurality of mold mask patterns, not facing other mold mask patterns,are exposed.
 41. The method of claim 40, wherein the forming of thefirst mask patterns comprises: forming a gap-fill protection film thatfills the mask spacers, only on the sidewalls of the portions of theplurality of mold mask patterns, facing other mold mask patterns; andremoving portions of the plurality of mask spacers, which are notcovered by the gap-fill protection film.
 42. The method of claim 41,wherein the forming of the gap-fill protection film comprises: forming aprotection film covering an upper surface and sidewalls of each of theplurality of mold mask patterns while filling gaps between adjacent maskspacers between adjacent mold mask patterns of the plurality of moldmask patterns; and etching the protection film when an upper surface ofthe protection film is completely exposed so that the protection filmcan remain only between mask spacers existing between the adjacent moldmask patterns.
 43. The method of claim 40, further comprising formingsecond mask patterns comprising first local patterns and second localpatterns on the substrate, wherein the first local patterns do not coverthe first mask patterns and the second mask patterns cover the firstmask patterns.
 44. The method of claim 43, wherein: the substratecomprises a memory cell region, a peripheral circuit region, and acontact region located between the memory cell region and the peripheralcircuit region; the first local patterns of the second mask patterns areformed in the memory cell region and the peripheral circuit region; andthe second local patterns of the second mask patterns are formed in thecontact region.
 45. The method of claim 43, further comprisingcompletely removing the plurality of mold mask patterns after the firstmask patterns are formed but before the second mask patterns are formed.46. The method of claim 45, further comprising etching the film that isto be etched, by using the first and second mask patterns as an etchmask, after the plurality of mold mask patterns are completely removed.47. The method of claim 46, wherein the film that is to be etchedcomprises a conductive layer.
 48. The method of claim 44, wherein: thefilm that is to be etched comprises a conductive layer; and the filmthat is to be etched is etched using the first and second hard maskpatterns as an etch mask so that a plurality of first conductive linesto which the first mask patterns have been transcribed and a pluralityof second conductive lines to which the first local patterns of thesecond mask patterns have been transcribed are formed within the memorycell region, a plurality of contact pads to which a shape in which thefirst mask patterns are combined with the second local patterns of thesecond mask patterns has been transcribed are formed in the contactregion, and a plurality of conductive patterns to which the first localpatterns of the second mask patterns have been transcribed are formed inthe peripheral circuit region.
 49. The method of claim 48, wherein thefirst conductive lines are word lines.
 50. The method of claim 48,wherein the first conductive lines are bit lines.